Характеристики
Диапазон рабочих температур
—
0 to 60°C
Интерфейс
—
SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management LID# / SLEEP# / PWRBTN#, Watchdog 4 x GPI, 4 x GPO (multiplexed with SD interface) Optional TPM 1.2 or 2.0 module onboard
Слоты расширения
—
3 x PCI-e x 1 lanes PCI-express Graphics (PEG) x8 (R-Series SoCs) or x4 (G-Series SOC-I and SoC-J)
Видеоинтерфейсы
—
Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0 (up to 2x DDIs with G-Series SoC-I and SoC-J) Optional VGA interface (excludes one DDI Port) Optional eDP or Single / Dual-Channel 18- / 24- bit LVDS interface (excludes one DDI Port)
Центральный процессор
—
AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15W AMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W AMD GX-215IJ, Dual Core @1.5GHz (2.0GHz Max), cTDP 6-10W
Число ядер
—
4
Все характеристики
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Образец на тестирование
AMOS is a COM Express® Compact Type 6 with the AMD Embedded 3rd
generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly
Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon) designed by SECO
that features up to 4 Excavator x86 CPU cores with the latest Radeon
graphics and I / O Controller on a single Chip; each Processor can scale
the TDP down to 15W. AMOS is ideal in applications where scalable graphics
performance makes the difference.
Документы
AMOS (COMe-A98-CT6)
3,6 мб
|
Диапазон рабочих температур
|
0 to 60°C |
|
Интерфейс
|
SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management LID# / SLEEP# / PWRBTN#, Watchdog 4 x GPI, 4 x GPO (multiplexed with SD interface) Optional TPM 1.2 or 2.0 module onboard |
|
Слоты расширения
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3 x PCI-e x 1 lanes PCI-express Graphics (PEG) x8 (R-Series SoCs) or x4 (G-Series SOC-I and SoC-J) |
|
Видеоинтерфейсы
|
Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0 (up to 2x DDIs with G-Series SoC-I and SoC-J) Optional VGA interface (excludes one DDI Port) Optional eDP or Single / Dual-Channel 18- / 24- bit LVDS interface (excludes one DDI Port) |
|
Центральный процессор
|
AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15W AMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W AMD GX-215IJ, Dual Core @1.5GHz (2.0GHz Max), cTDP 6-10W |
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Число ядер
|
4 |
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Память
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R-Series: Two SO-DIMM slots supporting DDR4 ECC / nonECC modules up to 2133MHz G-Series SoC-I: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 1600MHz G-Series SoC-J: One SO-DIMM slot supporting DDR4 nonECC modules up to 2133MHz |
|
Графический процессор
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AMD Radeon 3rd -Generation Graphics Core Next (GCN) AMD RX-421BD - Radeon R7 AMD RX-418GD, RX-416GD - Radeon R6 AMD-RX-216GD - Radeon R5 AMD GX-217GI - Radeon R6E AMD GX-224IJ - Radeon R4E AMD GX-215IJ - Radeon R2E Up to 3 independent displays supported (up to 2 with G-Series SoC-I and SoC-J) DirectX® 12 supported UVD 6 (4K H.265 and H.264 decode) and VCE 3.1 (4KH.264 encode) supported |
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Bидеоразрешения
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DDIs: up to 4K LVDS, VGA: up to 1920 x 1200 @ 60Hz |
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Накопитель
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2 x SATA Gen3 Channels SD interface shared with GPI/Os |
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Сети
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Gigabit Ethernet interface Intel® I210 / I211 GbE Controller |
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Usb
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4 x USB 3.0 Host ports 8 x USB 2.0 Host ports |
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Audio
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HD Audio Interface |
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Последовательные порты
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2 x HS UARTs |
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Блок питания
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+12VDC ± 10% and + 5VSB (optional) |
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Размер
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95 x 95 mm |
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Операционная система
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Microsoft® Windows 7 Microsoft® Windows 10 Microsoft® Windows 10 IoT Linux |
